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Currently, there is much discussion about the most appropriate modeling approach to represent the losses introduced by the metal surface roughness in PCB interconnects. Nonetheless, up until now there are no reported procedures to experimentally obtain the minimum frequency at which this effect should be considered in the modeling for a given metal profile. This is the topic covered in this presentation, where we also show that S-parameters measured at relatively low frequency may give important information about the interconnect such as the higher DC resistance of a smooth conductor coming from the same metal foil supplier.
-A detailed methodology for identifying the minimum frequency at which the metal surface roughness noticeably impacts the signal attenuation is proposed.
-Below the abovementioned frequency, considering the same copper weight, rough foils exhibit less resistance than smooth foils.
-Importance of measurements below 1 GHz for characterization purposes is highlighted.
Transmission line concepts, propagation mode, attenuation in striplines. Basics of the PCB manufacturing process.