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05. Advances in Materials and Processing for PCBs, Modules, and Packages
45-Minute Technical Session
Audience Level: All
These days, micro-electrical systems/devices require high integration density both laterally and vertically. System integration based on ultra-thin glass interposers/packages provides high integration density at the same time reducing the system cost. Low loss of the glass substrate enables high-speed signaling. We analyze and compare insertion loss, eye-diagram and bandwidth of various glass interposer channels with silicon and organic interposer channels. However, glass interposers/packages are vulnerable to noise generated in the PDN since low-loss of the glass substrate cannot attenuate the noise. We propose decoupling solutions such as embedded decaps and EBG designs suitable for glass interposers to solve PI issues.
In this study, we provide superiority of the low cost glass interposers and address challenges with proper solutions. Electrical performance of the glass interposer channels is superior than other interposers. However, glass interposers are vulnerable to PDN noise. We propose decoupling solutions suitable for glass interposers to solve PI issues.