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How to Keep Via to Via Coupling From Ruining Your Day

Eric Bogatin (Signal Integrity Evangelist, Teledyne LeCroy)

Fadi Deek (Corporate Application Engineer, Mentor Graphics)

Location: Chiphead Theater

Date: Wednesday, January 31

Time: 4:30pm - 5:15pm

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass - Get your pass now!

Track: Chiphead Theater (Free)

Format: 45-Minute Chiphead Theater Session

Vault Recording: TBD

Challenge your signal integrity know-how to solve our challenging but simple design questions.

If you look at crosstalk between two vias close or far apart, what influences the crosstalk you see? How much will crosstalk drop off as we move the vias apart and how much do we need to move them away to reduce the crosstalk to a negligible value?

If the signal vias pass through two different voltage planes, would adding a capacitor improve the crosstalk between the two vias or make it worse? Does it matter where we put the capacitors?

These puzzles are important in board design, but have counter intuitive or confusing expectations unless you really understand the underlying principles.