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Amendra Koul (Technical Leader - Signal Integrity, Cisco systems inc)
David Hoover (Sr Field Application Engineer - Communications & Computing Business , TTM Technologies, Inc.)
Location: Ballroom D
2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass
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08. Optimizing High-Speed Serial Design
75-Minute Panel Discussion
The objective of this panel session is to guide design teams through the process of evaluating and selecting the right glass styles or design strategies for eliminating glass-weave skew for multi-gigabit, high-speed PCB designs. Several methods have been proposed, including choosing a glass style that minimizes resin windows, aligning trace direction to the fill/weft, routing each member of the pair at the same pitch as the glass fibers, mechanically spread glass, dual-ply glass, zigzag routing of differential pairs at a 10º angle to the weave, building each PCB with the artwork rotated at a 10º angle to the panel and weave, or using glass with a lower dielectric constant (closer to the resin Dk).
In this panel session, we’ll nail down the answers to this quintessential design concern once and for all – or entertain you while the experts slug it out!