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01. Signal & Power Integrity at the Single-Multi Die, Interposer, and Packaging Level
75-Minute Panel Discussion
Audience Level: All
A panel of contributors from a new industry consortium, the USR Alliance will discuss the challenges of connecting semiconductor dies on large MCMs (Multi-Chip Modules), which have become the new printed circuit boards as bandwidth and power dissipation has escalated. The presenters will discuss the MCM-focused technical specifications that are being worked on at the Alliance and will also talk about their company's viewpoints about the reaches, modulation techniques, and measurement techniques needed to create a multi-vendor ecosystem of devices for MCMs.
Audience members will learn about the technical challenges of System in Package and Multi-Chip-Module devices that have led to launch of a new standards development organization, the USR Alliance, which is focused on developing interoperability specifications to enable these emerging ecosystems.
Audience members may benefit from having some familiarity with high-speed interconnect and multi-chip modules.