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Tale of a Differential Pair Measurement

Gustavo Blando (Senior Principal Engineer, Oracle Corporation)

Istvan Novak (Senior Principle Engineer, Oracle Corporation)

Eben Kunz (Senior Hardware Engineer, Oracle Corporation)

Gregory Truhlar (Senior Hardware Engineer, Oracle Corporation)

Location: Ballroom G

Date: Wednesday, January 31

Time: 9:00am - 9:45am

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass - Get your pass now!

Track: 04. System Co-Design: Modeling, simulation and measurement validation

Audience Level: Introductory

Format: 45-Minute Technical Session

Vault Recording: TBD

Audience Level: Introductory

How accurately can a high frequency VNA measurement be performed when wafer probes are involved? What do we compare against? Considering the vast variety of VNA calibrations techniques, how do we know what is the best mechanism to use? What simulation tools do we use to correlate? How do we measure a DUT without affecting it? These are questions SI engineers ask themselves all the time. By using a differential trace, we will show the complexities of a real differential pair, including skew, crosstalk, and losses, the pitfalls of measurements, including different types of calibration, de-embedding and simulations techniques

Takeaway

• Errors to be expected with accurate measurements using wafer probes (potential improvement of wafer probe to avoid these issues)
• Comparison of different calibration techniques , (pitfalls and errors)
• Simulation tools correlations to measurements
• Hidden complexities of differential pair and what to look for when extracting data for material characterization