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Dale BeckerChief Engineer of Electronic Packaging IntegrationIBM

Dale Becker received the B.E.E degree from the University of Minnesota, M.S.E.E. from Syracuse University and the Ph.D. from the University of Illinois at Urbana Champaign. He is a Chief Engineer of Electronic Packaging Integration in IBM Systems and a member of the IBM Academy of Technology. His responsibility is the electrical system architecture of IBM Systems including the design of high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem. Dr. Becker has chaired the IEEE EPEPS Conference in 2010, 2014, and 2016 and has co-chaired the 2014 IEEE EMCS embedded conference on SIPI TPC as well as 2017 EMCS Global University Chair. He has been a distinguished lecturer in the EMC Society. He has patents on electrical design of computer systems and has presented papers in refereed journals and international conferences covering many aspects of electrical computer system design including power distribution analysis and design and modeling of signal and power distribution networks. He is an IEEE Fellow, an iNEMI Technical Committee member, and a member of SWE.