Antonio Ciccomancini Scogna,
Antonio Ciccomancini Scogna (M’00-SM’09) received the Ph.D. degree in Electrical Engineering from the University of L’Aquila, L’Aquila, Italy, in 2004. In 2004–2014, he was with the Computer Simulation Technology of America, Framingham, MA, USA, where he was the first Principal Application Engineer and later EDA Market Development Manager. He worked as Signal and Power Integrity Scientist with the Silicon Engineering Group (SEG) at Apple, Cupertino, CA, USA Currently he is Principal engineer with Samsung Electronics Mobile Division. His research interests include signal and power integrity for high speed digital and mixed signal, EMC/EMI, new technologies for power consumption, noise mitigation and RFI/desense modeling methodologies. In 2004, he received the CST publication award for the use of the Finite Integration Technique in signal integrity applications. He received the DesignCon Best Paper Award in 2009 and 2017. In 2010, he was awarded with the Best Paper in the Transaction of Advanced Packaging. He received the Best Paper Awards from IMAPS in 2010 and 2011. He is Associate Editor of T-EMC and serves as reviewer of a number of Journal Transactions and International Conferences.