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Joungho KimProfessorKorea Advanced Institute of Science and Technology

Joungho Kim received the B.S. and M.S. degrees in electrical engineering from Seoul National University, Seoul, South Korea, in 1984 and 1986, respectively, and the Ph.D. degree in electrical engineering from the University of Michigan, Ann Arbor, MI, USA, in 1993. In 1994, he joined the Memory Division, Samsung Electronics, Company Ltd., Sumon, South Korea, where he was involved in gigabit-scale DRAM design. In 1996, he moved to the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea. He is currently a Professor with the Electrical Engineering Department, KAIST. Also, he is the Director of the 3DIC Research Center, supported by SK Hynix Inc., Icheon, South Korea, and the Smart Automotive Electronics Research Center supported by Korea Electric Terminal, Incheon, South Korea. Since joining KAIST, his research centers on EMC modeling, design, and measurement methodologies of 3-D IC, through silicon via (TSV), interposer, system-in-package, multilayer printed circuit board (PCB), and wireless power transfer technologies. He has authored and coauthored over 480 technical papers published in refereed journals and conference proceedings. He has given over 263 invited talks and tutorials in academia and related industries. He has authored a book Electrical Design of Through Silicon Via (Springer, 2014). His current research interests include chip-package-PCB codesign and co-simulation for signal integrity, power integrity, ground integrity, timing integrity, and radiated emission in 3-D IC, TSV, and interposer. Dr. Kim received the Outstanding Academic Achievement Faculty Award of KAIST in 2006, the KAIST Grand Research Award in 2008, the National 100 Best Project Award in 2009, the KAIST International Collaboration Award in 2010, the KAIST Grand Research Award in 2014, the Teaching Award in 2015, and the Technology Achievement Award from the IEEE Electromagnetic Society in 2010. He was the Conference Chair of the IEEE EDAPS 2015, Seoul, and the Joint Conference Chair of the Japan-Korea Microwave Society in 2015. He also was the Conference Chair of the IEEE Wireless Power Transfer Conference in 2014, Jeju Island, South Korea. He was the Symposium Chair of the IEEE EDAPS Symposium in 2008, and the TPC Chair of the APEMC 2011. He is an Associate Editor of the IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. He served as a Guest Editor of the special issue in the IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY for PCB level signal integrity, power integrity, and electromagnetic interference/EMC in 2010, the special issue in the IEEE TRANSACTIONS ON ADVANCED PACKAGING for TSV in 2011, and the minispecial issue in the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES for the IEEE WPTC in 2015. He was an IEEE EMC Society Distinguished Lecturer from 2009 to 2011.