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Dong Soon LimSenior Engineer – Package Signal IntegrityMicron Technology, Inc.

Dong Soon Lim received a B.S. degree in electrical engineering from the University of Dong-A (Busan, Korea) in 1996. He is working as a senior signal integrity engineer at Micron Technology, Inc. (Boise, Idaho USA). He is responsible for the electrical models, substrate design optimization, SI and PI performance of high speed memory packages. His interests include high speed package design and system level analysis for high-speed products, such as LPDDR4 and graphic DRAM. Before joining Micron, he worked as senior signal Integrity engineer in the area of wireless network system, mobile chip & package, and mobile product at Samsung Electronics (Suwon, Korea).

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