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Richard MellitzDistinguished EngineerSamtec

Richard Mellitz is employed by Samtec, Inc. supporting interconnect signal integrity and industry standards. He was a Principal Engineer in the Platform Engineering Group at Intel until retiring is June 2016. Richard was key member of various processor and I/O bus teams including Itanium®, Pentium® 4, and PCI Express®, SAS®, and Fabric (Ethernet, IB, and proprietary). Additionally he has been a contributor for the channel sections of the 2.5, 5, 10, 40, 50, 100, 200 and 400 Gbps IEEE802.3 backplane and cabling standards. Time domain interconnect specs for IEEE Ethernet, know as COM, are now and integral part of part of Ethernet standard due to Rich’s leadership. He founded and chaired an IPC committee delivering IPC’s first PCB loss test method. Richard holds a number of patents in interconnect, signal integrity, design, and test and has delivered many signal integrity papers at PC industry design conferences. Richard wrote the original IPC TDR standard which is used throughout the PWB industry. In addition over the years at Digital, AT&T, NCR, and Intel Rich spearheaded, developed, and lead dozens of signal integrity and process control automation tools.