Super Early Bird Registration Now Open till October 12th. Save Up to $400 Today!

Walt ModenPrincipal Engineer – Package DesignMicron Technology, Inc.

Walter Moden received a B.S. and 2 M.S. degrees from the University of Idaho (Moscow, ID) in 1984, 1986, and 1989. He has been at Micron Technology, Inc. (Boise, Idaho USA) since 1988, holding various positions in the Assembly and Packaging Groups. Currently working as a Principle Package Design Engineer focusing on high speed memory. Mr. Moden holds over 140 U.S. and foreign patents.

Presenting: