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Bo PuSenior EngineerSamsung Electronics

Bo Pu is Senior Engineer in Power and Signal Integrity (PSI) group at Samsung Electronics. He received the B.S. in electrical engineering from the Harbin Institute of Technology, China, in 2009, and combined M.S. & Ph.D. in Electrical and Electronics Engineering from Sungkyunkwan University, Korea, in 2015. His research interests include modeling, design, and analysis of high-speed and high-frequency chip-package-PCB systems for signal integrity, power integrity, and electromagnetic interference (EMI) and EMC. In particular, his current research interests include the design and analysis of high speed SerDes links at multiple Gbps. Dr. Pu received the Best Student Paper Award at the IEEE Asia-Pacific Symposium on Electromagnetic Compatibility in 2011 and a Young Scientists Award from the International Union of Radio Science in 2014.

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