April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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2.5D/3D Architecture Solutions


Ming Li  (Technical Director, Rambus)

Location: Great America Meeting Room 1

Date: Wednesday, April 6

Time: 4:00 pm - 4:45 pm

Track: Sponsored Session

Format: Sponsored Session

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

2.5D/3D solutions promise benefits including continued performance scaling and higher bandwidth connections between chips. In order to realize these benefits, expertise in power integrity (PI), signal integrity (SI), interposer design and system-level simulation are required. This presentation will cover the design considerations and methodologies for successfully implementing a 2.5D/3D design for an HBM2E/HBM3 system.