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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Ming Li (Technical Director, Rambus)
Location: Great America Meeting Room 1
Date: Wednesday, April 6
Time: 4:00 pm - 4:45 pm
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Vault Recording: TBD
Audience Level: All
2.5D/3D solutions promise benefits including continued performance scaling and higher bandwidth connections between chips. In order to realize these benefits, expertise in power integrity (PI), signal integrity (SI), interposer design and system-level simulation are required. This presentation will cover the design considerations and methodologies for successfully implementing a 2.5D/3D design for an HBM2E/HBM3 system.