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3D Packaging Solutions

Ming Li  (Technical Director, Rambus)

Location: Great America 3

Date: Wednesday, January 29

Time: 3:45pm - 4:25pm

Track: Sponsored Session

Vault Recording: TBD


3D packaging promises benefits including continued performance scaling and higher bandwidth connections between chips. In order to realize these benefits expertise in power integrity (PI), signal integrity (SI), interposer design and system-level simulation are required. This presentation will cover the design considerations and methodologies for successfully implmenting a 3D package design for an HBM2/HBM2E solution.