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Ming Li (Technical Director, Rambus)
Location: Great America 3
Date: Wednesday, January 29
Time: 3:45pm - 4:25pm
Track: Sponsored Session
Vault Recording: TBD
3D packaging promises benefits including continued performance scaling and higher bandwidth connections between chips. In order to realize these benefits expertise in power integrity (PI), signal integrity (SI), interposer design and system-level simulation are required. This presentation will cover the design considerations and methodologies for successfully implmenting a 3D package design for an HBM2/HBM2E solution.