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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Yuandong Guo (Ph.D Student, EMC Laboratory, Missouri University of Science and Technology)
DongHyun Kim (Assistant Professor, EMC Laboratory, Missouri University of Science and Technology)
Location: Ballroom G
Date: Wednesday, April 6
Time: 12:15 pm - 1:00 pm
Track: 13. Modeling & Analysis of Interconnects, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass
Vault Recording: TBD
Audience Level: Advanced
The FEXT of typical high-speed PCB striplines is mainly attributed to the dielectric inhomogeneity. In order to characterize the inhomogeneous dielectric materials and predict the FEXT of PCB striplines, an extraction method for the dielectric constants (Dks) of both core and prepreg has been proposed recently. However, the material inhomogeneity is not rigorously addressed in the approach, because it simplifies the inhomogeneous dielectric layers (IDLs) into two groups, namely, core and prepreg layers. It is not possible to evaluate the impact of increasing number of plies of glass fibers in core or prepreg with the existing model prior to the fabrication and measurement of PCB striplines. In this paper, the inhomogeneity problem is addressed comprehensively through the novel algorithm which characterizes Dkglass and Dkresin, and the proposed model can predict the effect of modifications made to the thickness and number of glass fibers in IDL without fabricating the test coupons. In addition, the impacts of locations of glass fibers, glass fiber thickness, and glass fiber shapes, are analyzed using the proposed model, full-wave simulations, and the statistical method presented in the paper. PCB design and fabrication suggestions for FEXT noise mitigation and control are provided.
a. The proposed novel IDL model can address a comprehensive view for dielectric material inhomogeneity of PCB striplines.
b. Several critical geometrical factors are identified and evaluated for their impacts on FEXT.
c. PCB design and fabrication suggestions are developed for FEXT noise mitigation and control.
Targeting for the audience with 8+ years experience in signal integrity design with special interest or expertise in far-end crosstalk analysis.