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A Practical Method for 3D-Modeling of Glass Weave

Kenji Nonaka (Engineer, Sony LSI Design Incorpolated)

Location: Ballroom G

Date: Wednesday, January 29

Time: 9:00am - 9:45am

Track: 13. Modeling & Analysis of Interconnects

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

It has become important to make printed circuit board models for SI simulation with the effect of glass weave as the signal frequency of interconnect becomes higher. Most of previous works were based on measurement results. They have adequate accuracy, but are not suitable for the consumer product design with low cost and/or short TAT. In this paper, we propose a practical modeling method of glass weave using only general information obtained from board manufacturers. In order to confirm the accuracy of this method, we designed several measurement boards and confirmed there was a high correlation between simulation and measurement.

Takeaway

This paper will show a practical simulation-based modeling method of glass fiber using only general information of board. The findings from this study suggest our method be applied to SI simulation in the real product design.