DesignCon 2020 Schedule Builder

System design advancements in 5G, automotive, data center and IoT, etc. are driving a broad need in seeking faster and smarter electronic solutions. Industry’s traditional, decades-long multi-physics solutions such as 3D EM field solvers or 3D thermal solvers, though providing accurate results, have often failed to provide efficient simulation power and analysis capability on today’s large system structures. Their old methodology of divide and conquer by slicing a large structure into multiple smaller pieces is obviously error-prone, losing accuracy in its final results.

Equipped with Cadence’s signature massively parallel execution algorithm in matrix solving, Clarity™ 3D Solver and Celsius™ Thermal Solver have brought system level multi-physics simulation technology to an unprecedented level: enabling engineers to efficiently analyze a large system structure by distributing the simulation over 1,000s of CPU cores, either in-premises or over a cloud. This paper will present our innovative technologies for Clarity 3D EM extraction and modeling, and for Celsius 3D electrical-thermal co-simulation. It will also show multiple complex testcase results to demonstrate the near-linear scalable simulation performance and virtually unlimited capacity in both tools, which provides solutions to meet customer’s aggressive time-to-market challenges. "