DesignCon is part of the Informa Markets Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.


Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Accelerating Your System Designs with Latest Multi-Physics Simulation Technologies

Ben Gu (Senior Software Engineering Group Director, Cadence)

Location: Mission City M1

Date: Thursday, January 30

Time: 9:05am - 9:45am

Track: Sponsored Session

Vault Recording: TBD

cadence design system

System design advancements in 5G, automotive, data center and IoT, etc. are driving a broad need in seeking faster and smarter electronic solutions. Industry’s traditional, decades-long multi-physics solutions such as 3D EM field solvers or 3D thermal solvers, though providing accurate results, have often failed to provide efficient simulation power and analysis capability on today’s large system structures. Their old methodology of divide and conquer by slicing a large structure into multiple smaller pieces is obviously error-prone, losing accuracy in its final results.

Equipped with Cadence’s signature massively parallel execution algorithm in matrix solving, Clarity™ 3D Solver and Celsius™ Thermal Solver have brought system level multi-physics simulation technology to an unprecedented level: enabling engineers to efficiently analyze a large system structure by distributing the simulation over 1,000s of CPU cores, either in-premises or over a cloud. This paper will present our innovative technologies for Clarity 3D EM extraction and modeling, and for Celsius 3D electrical-thermal co-simulation. It will also show multiple complex testcase results to demonstrate the near-linear scalable simulation performance and virtually unlimited capacity in both tools, which provides solutions to meet customer’s aggressive time-to-market challenges. "