April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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Accurate Correlation Between SI Simulation & Measurement in High-speed Backplane Connector Designs


Leon Wu  (SI Engineer, Samtec)

Mick Zhou  (Manager, Samtec)

Location: Ballroom G

Date: Wednesday, April 6

Time: 9:00 am - 9:45 am

Track: 13. Modeling & Analysis of Interconnects, 06. System Co-Design: Modeling, Simulation & Measurement Validation

Format: Technical Session

Education Level: All

Pass Type: 2-Day Pass, All Access Pass

Vault Recording: TBD

Audience Level: All

In this paper, we developed a systematic methodology for accurate correlation between SI simulation and measurement in high-speed backplane connector designs. A statistical method is used to generate reference data based on measurements of multiple samples. It is a long-standing challenge to model nickel plating accurately and efficiently in large backplane connectors. It is very difficult to find accurate permeability of nickel and simulate the physical plating layers in large connectors models. A new method for extracting equivalent permeability of different plating based on propagation constants of airline structures with similar plating is proposed. The extracted permeability value is validated in the case of airline structures in both time and frequency domains. Finally, an optimization procedure is employed to a multi-variable problem to correlate simulations and measurements based on merits of S-parameters. Two real high-speed backplane connector series are used as examples to show the effectiveness of the systematic methodology.


A new method for extracting equivalent permeability of different plating based on Telegrapher's equations and airline structures with plating layers is proposed. The corresponding results can be used effectively in large backplane connector simulations to achieve excellent correlation between simulation and measurement using multi-variable optimization process.