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Advanced Interconnect Process Enables Very High Density PCB Structures

Mike Vinson  (President, Averatek)

Location: Ballroom E

Date: Wednesday, January 29

Time: 8:00am - 8:45am

Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

Complex electronics combined with larger component package obsolescence drives innovation for PCB technology that reliably provides circuit layers with 25 micron or finer feature size. LMI technology is one of these innovations. LMI allows a dense, thin catalytic seed layer resulting in a thin, dense electroless copper layer used as a base for much thicker electrolytic copper. The electroless copper is so thin (0.1 um) compared to the electrolytic copper (> 10um) very fine geometries are defined with a simple flash etching process. This core technology enables a SAP process (Semi-Additive-Process) fabricating these fine feature sizes.


LMI (Liquid Metal Ink) enables an SAP process that reliably provides circuit layers with 25 micron or fine feature size helping to solve routing constraints for complex electronic applications. The SAP process can be used as an alternative to or in combination with subtractive etch processing.

Intended Audience

PCB design experience and working knowledge of traditional PCB fabrication processes

Presentation Files