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Advanced Package Design Sign-Off Reference Flow

Sungwook Moon Ph.D. (Principal Engineer, Samsung Foundry Korea)

Max Min Ph.D. (Director, Samsung Foundry US)

Location: Great America 3

Date: Thursday, January 31

Time: 2:50pm - 3:30pm

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD

Cadence Design Systems

Heterogeneous system integration in advanced packages gives a significant challenge to power integrity and signal integrity. With the advanced packaging reference flow, joint customers of Cadence and Samsung Foundry have a well-documented step-by-step approach to validate these critical electrical requirements for enabling the first-pass success. This session presents Samsung Foundry advanced package solutions and its reference flow. The flow describes system-level power delivery network analysis, high-speed parallel interface sign-off and high-speed serial interface sign-off.