Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.
Yan Fen Shen (Analog Engineer, Intel Corporation)
Ben Silva (Analog engineer, Intel Corporation)
Location: Ballroom E
Date: Thursday, January 30
Time: 9:00am - 9:45am
Track: 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: All
This paper takes an in depth look at the pros and cons of different filtering techniques as a mean to isolate a noisy source from a sensitive power supply. As modern day microprocessor and power electronics continue to get smaller and thinner, the amount of available space for Power Integrity engineering is reduced and it becomes inevitable that multiple power domains are combined at the package substrate or motherboard. Managing the noise coupling between these shared power domains then becomes essential and this paper will investigate the various filtering techniques from performance, design complexity, cost, and size perspectives.
A good understanding of the various filtering options available for HVM on package and PCB, and how they compare with one another from a performance, cost, size, and complexity standpoint.