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Analysis of Via to Via Crosstalk for Single Ended & Differential Signals in the Time & Frequency Domains

Fadi Deek (Corporate Application Engineer, GSS High Speed, Siemens)

Eric Bogatin (Dean, Teledyne LeCroy Signal Integrity Academy)

Cristian Filip (Product Architect High-Speed Analysis Products, Mentor, A Siemens Business)

Melinda Piket-May (Professor, University of Coloardo at Boulder)

Chuck Ferry (Systems Architect Director, Mentor, A Siemens Business)

Location: Ballroom F

Date: Wednesday, January 30

Time: 8:00am - 8:45am

Track: 14. Modeling & Analysis of Interconnects, 04. System Co-Design: Modeling, Simulation & Measurement Validation

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

The return current of a signal passing through a via will generate a radial wave that propagates through the cavity and as a result encounters the impedance of the cavity. With this root cause identified, the coupling between the vias is broken into three constituents: the radial wave coupling, excitation of cavity structural resonances and lumped resonances. Each of the three mechanisms is analyzed, simulated and measured to provide an understanding of its electrical signature and contribution to the overall crosstalk. Methods to mitigate the noise from each mechanism are explored. Study is applied to single ended and differential vias

Takeaway

Return currents of high speed signals propagating through vias in PCB cavities encounter the impedance of the cavity. As a result crosstalk induced on other vias is composed of radial wave coupling and excitation of different resonances. Each mechanism's electrical signature is presented and results validated by simulations and measurements.

Presentation Files

SLIDES_14_AnalysisOfViaToVia_Deek.pdf
PAPER_14_AnalysisofViatoVia_Deek.pdf