April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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Bespoke Silicon: How Systems Companies are Driving Chip Design


Rob Aitken  (Arm Fellow and Director of Technology, Arm Research)


John Lee  (General Manager Semiconductor, Electronics & Optics Business Unit, Ansys)

Location: Chiphead Theater

Date: Wednesday, April 6

Time: 3:15 pm - 4:00 pm

Track: Chiphead Theater, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging

Format: Chiphead Theater

Theme : Automotive, Data Centers

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

Leading systems companies are now designing bespoke silicon: large, advanced chips that are tailored to the specific needs of their system product. Apple’s M1 chip powers the latest MacBooks. The new AI-enabled Pixel 6 is powered by Google’s bespoke silicon. Hyperscalers Amazon, Microsoft and Meta are filling their data centers with their own bespoke silicon as Tesla similarly enables autonomous driving. The move to bespoke silicon provides a distinct competitive advantage to these and other early movers over their competition still relying on standard off-the-shelf chips.

But bespoke silicon brings with it immense challenges, and as a result unlike its predecessor, ASIC, is not available to all. Supporting the immense complexity of system-level design dictates pioneering use of 3D-IC. This panel will explore the factors driving leading systems companies to design bespoke silicon, and the challenges they are encountering, including the consideration of system-level issues and physics that are not adequately addressed in conventional IC design.