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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Rob Aitken (Arm Fellow and Director of Technology, Arm Research)
John Lee (General Manager Semiconductor, Electronics & Optics Business Unit, Ansys)
Location: Chiphead Theater
Date: Wednesday, April 6
Time: 3:15 pm - 4:00 pm
Track: Chiphead Theater, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Chiphead Theater
Theme : Automotive, Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Vault Recording: TBD
Audience Level: All
Leading systems companies are now designing bespoke silicon: large, advanced chips that are tailored to the specific needs of their system product. Appleâ€™s M1 chip powers the latest MacBooks. The new AI-enabled Pixel 6 is powered by Googleâ€™s bespoke silicon. Hyperscalers Amazon, Microsoft and Meta are filling their data centers with their own bespoke silicon as Tesla similarly enables autonomous driving. The move to bespoke silicon provides a distinct competitive advantage to these and other early movers over their competition still relying on standard off-the-shelf chips.
But bespoke silicon brings with it immense challenges, and as a result unlike its predecessor, ASIC, is not available to all. Supporting the immense complexity of system-level design dictates pioneering use of 3D-IC. This panel will explore the factors driving leading systems companies to design bespoke silicon, and the challenges they are encountering, including the consideration of system-level issues and physics that are not adequately addressed in conventional IC design.