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Broadband Determination of Dielectric Dissipation Factor by Implementing the Multi-Pole Debye Model Through Linear Regressions

Eduardo Moctezuma-Pascual (PhD. student, INAOE)

Dr. Svetlana C. Sejas-Garcia (Microwave engineering , SV probe)

Doug Trobough (Corporate Director Applications Engineering and TPM, Isola-Group)

Reydezel Torres-Torres (Senior Researcher with the Electronics Department, INAOE)

Location: Ballroom A

Date: Thursday, January 30

Time: 9:00am - 9:45am

Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

Whereas determining Dk of a PCB laminate is simple from transmission-line measurements using either TRL-like or Delta-L extractions, obtaining Df is cumbersome since S-parameters include the combined effect of dielectric and metal losses. This becomes accentuated in advanced processes due to the extremely low Df achieved in today's laminates. Nonetheless, Df is a key figure-of-merit for assessing PCBs intended for multigigabit-per-second data transmission. Hence, we take advantage of the accuracy achieved in obtaining Dk to systematically implement, through simple linear regressions, a multi-pole Debye model that allows reproducing Df for an advanced laminate at least up to 50 GHz

Takeaway

• Broadband determination of Df for PCB laminates is tough due to its small magnitude and the impossibility to separately measure metal and dielectric losses. • Dielectric parameters are mathematically connected. Thus, once the Dk curve is appropriately represented, obtaining Df is straightforward. • Regressions can be used to obtain the model parameters.

Intended Audience

S-parameters, complex permittivity modeling, dissipation factor, Debye model.