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Location: Ballroom A
Date: Thursday, January 30
Time: 9:00am - 9:45am
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: All
Whereas determining Dk of a PCB laminate is simple from transmission-line measurements using either TRL-like or Delta-L extractions, obtaining Df is cumbersome since S-parameters include the combined effect of dielectric and metal losses. This becomes accentuated in advanced processes due to the extremely low Df achieved in today's laminates. Nonetheless, Df is a key figure-of-merit for assessing PCBs intended for multigigabit-per-second data transmission. Hence, we take advantage of the accuracy achieved in obtaining Dk to systematically implement, through simple linear regressions, a multi-pole Debye model that allows reproducing Df for an advanced laminate at least up to 50 GHz
• Broadband determination of Df for PCB laminates is tough due to its small magnitude and the impossibility to separately measure metal and dielectric losses. • Dielectric parameters are mathematically connected. Thus, once the Dk curve is appropriately represented, obtaining Df is straightforward. • Regressions can be used to obtain the model parameters.
S-parameters, complex permittivity modeling, dissipation factor, Debye model.