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Closing the Gap: Memory Solutions for AI/ML

Frank Ferro  (Senior Director of Product Marketing, Rambus)

Location: Great America 3

Date: Wednesday, January 29

Time: 12:05pm - 12:45pm

Track: Sponsored Session

Vault Recording: TBD


Rapid advances in artificial intelligence have re-energized the semiconductor industry, with numerous companies developing AI-specific silicon aimed at providing ever-higher levels of performance and power efficiency. As our increasingly connected world evolves, AI continues to evolve as well. But several critical challenges await chip and system designers as our industry strives to meet the relentless demands for more performance and better power efficiency. Among the most critical of these challenges are memory system bottlenecks impacting processor design. In this presentation we'll cover the memory solutions, such as HBM2 and GDDR6, that can provide continued progress of AI silicon.