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DesignCon 2019 Presentation Viewer

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Distributed Decoupling Capacitors Application for PDN Designs of Fine Pitch BGA Products

Amiram Jibly (Senior SI Engineer, Intel)

Igal Fridman (Senior Hardware Engineer, Major Technology Company)

Shimon Morodooch (R&D Project Manager, Harmonic Video Networks)

Alex Manukovsky (Technical Lead, SI/PI Team, Intel)

Location: Ballroom B

Date: Thursday, January 31

Time: 11:00am - 11:45am

Track: 11. Power Integrity in Power Distribution Networks

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

The electronics market is rapidly moving toward product minimization.The drive for low power, high-efficiency and fastest performance is forcing the designers to adopt fine pitch BGA, micro CSPs and micro BGAs technologies. Discreet decoupling capacitors, used to control PDN impedance at MHz to GHz frequency band for years, are unsuitable for contemporary products of BGA pitch below 0.8 [um]. We hereby examine the use of distributed capacitors based on thin and ultra-thin film laminates for controlling PDN impedance of fine-pitch BGA designs, along with other approaches such as Si-based capacitors and distributed capacitors of standard laminates. The resulting power integrity simulation and PDN lab measurements are presented. Practical design aspects, benefits and limitations are discussed.

Takeaway

Using discreet decoupling capacitors under BGA is no longer a feasible solution for the new generation of products as the BGA pitch is below 0.8 [um]. Here we examine the use of distributed capacitors based on thin film laminates for controlling PDN impedance at the MHz to GHz frequency band of fine pitch BGA design.