April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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Electrothermal Co-Simulation for PCB and Package Designs Using Celsius Thermal Solver


Karthick Gopalakrishnan  (Product Engineer, Cadence)

Location: Mission City Ballroom B5

Date: Thursday, April 7

Time: 5:00 pm - 5:45 pm

Track: Sponsored Session

Format: Sponsored Session

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

Thermal management of electronics becomes more critical and complex when resistive losses in PCB and package structures are significant. These resistive losses are also temperature dependent, making electrothermal co-simulation necessary for such designs. In this presentation, we will look at using the Celsius Thermal Solver for thermal and electrothermal analyses at the PCB and package level. We will also look at how such designs can be simulated within electronics systems to capture important system effects (such as airflow within an enclosure) and cooling mechanisms (such as heatsinks and fans).