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Evolution of Transceiver On-Die Termination Models for IBIS-AMI & COM

Masashi Shimanouchi (Design Engineer, Intel)

Hsinho Wu (Design Engineer, Intel)

Mike Peng Li (Fellow, Intel)

Location: Ballroom C

Date: Thursday, January 30

Time: 11:00am - 11:45am

Track: 07. Optimizing High-Speed Serial Design

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

High speed serial link simulation has become indispensable for channels design. On-die termination model has been one of the essential building blocks of transceiver model, and it has been evolving with increasing data rate. While IBIS-AMI and COM are most popular simulation methods, their approach for on-die termination modeling is different because of their different priorities. After overview of these simulation methods, on-die termination technology is reviewed. Then we discuss how on-die termination models have evolved for IBIS-AMI and COM differently to present 100~116Gbps PAM4 standards, and what to consider for the next generation model above 200G.

Takeaway

While on-die termination model is one of the essential transceiver building blocks, it has evolved differently for IBIS-AMI and COM because of their different priority. We discuss the evolution of die-termination technology and its modeling to today's 100G PAM4, and what to consider for next generation 200G COM.

Intended Audience

While on-die termination model is one of the essential transceiver building blocks, it has evolved differently for IBIS-AMI and COM because of their different priority. We discuss the evolution of die-termination technology and its modeling to today's 100G PAM4, and what to consider for next generation 200G COM.