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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Eric Bogatin (Professor, University of Colorado, Boulder)
Melinda Piket-May (prof, CU)
Aditya Rao (Grad student, CU)
Julio Puentes (Undergraduate, CU)
Location: Ballroom H
Date: Wednesday, April 6
Time: 3:00 pm - 3:45 pm
Track: 12. Applying Test & Measurement Methodology, 04. Advances in Materials & Processing for PCBs, Modules & Packages
Format: Technical Session
Theme : High-speed Communications
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Vault Recording: TBD
Audience Level: Introductory
One of the research activities of the High-Speed Digital Engineering Group at the University of Colorado, Boulder, is developing very low-cost technology solutions for signal integrity applications. We show four of these projects. One is designing optimized launches using low cost SMA connectors that can operate up to 15 GHz. Another project is to extract the Dk of a PCB layer using a special test structure and TDR measurements. The third project is generating a 5 Gbps PRBS signal for $5. The fourth project is measuring the bandwidth of a scope-probe system up to 2 GHz with a $60 source.
Sometimes, it is possible to find an acceptable compromise between good enough, high enough bandwidth and low cost. We offer a few examples.
We present four very low-cost solutions to SI problems: SMA launches to PCB traces for $0.35 with a 15 GHz bandwidth, a simple Dk measurement with a TDR using one test structure, generating 5 Gbps PRBS signal for $5 and measuring the insitu bandwidth of a scope and its probes.