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Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Holistic System-Level Design and Analysis of Chips, Packages, and Boards

John Park  (Product Management Group Director, Cadence)

Location: Mission City M1

Date: Thursday, January 30

Time: 2:50pm - 3:30pm

Track: Sponsored Session

Vault Recording: TBD

Cadence Design Systems

A holistic system design approach is presented which facilitates co-design and analysis of a multi technology array of ICs, packages and PCBs. The proposed methodology simulates and thus co designs an IC in context of its PCB and package parasitic models within the IC designers design environment, without a deep dive into packaging and PCB design techniques. The key benefit is allowing analog/RF designers drive designs of modules to their packaging teams and define system simulation testbenches, including all non-idealities, prior to tapeout. This “one-stop” solution applies quite well across mmWave RF, power management ICs and low power analog front ends.