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Holistic System-Level Design and Analysis of Chips, Packages, and Boards
John Park (Product Management Group Director, Cadence)
Location: Mission City M1
Date: Thursday, January 30
Time: 2:50pm - 3:30pm
Track: Sponsored Session
Vault Recording: TBD
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A holistic system design approach is presented which facilitates co-design and analysis of a multi technology array of ICs, packages and PCBs. The proposed methodology simulates and thus co designs an IC in context of its PCB and package parasitic models within the IC designers design environment, without a deep dive into packaging and PCB design techniques. The key benefit is allowing analog/RF designers drive designs of modules to their packaging teams and define system simulation testbenches, including all non-idealities, prior to tapeout. This “one-stop” solution applies quite well across mmWave RF, power management ICs and low power analog front ends.