Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.
Pete Uka (Director Of Technology, Q-flex Inc.)
CHIRANJEEV PATIL (Electrical Engineer, Q-flex Inc.)
Nishal Uka (Technical Co-ordinator, Q-flex Inc.)
Location: Chiphead Theater
Date: Wednesday, January 29
Time: 3:15pm - 3:25pm
Track: Chiphead Theater, 04. Advances in Materials & Processing for PCBs, Modules & Packages
Format: Lightning Talk
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass, Boot Camp Pass, Expo Pass - Get your pass now!
Vault Recording: TBD
Audience Level: All
Lightning Talks are technical papers that were accepted as part of the DesignCon conference, but are being made available to all attendees as short sessions in the Chiphead Theater.
Paper description: It is a common practice to use a discrete device like a thermistor, thermocouple or RTD to measure the temperature of a surface. These discrete devices must be placed on the PCB surface and take up valuable x,y,z axis real estate. Fitting into this area can be an issue in tight applications. Additionally, solder joints which are required to attached the device to the board surface can break with board handling or flexing or can be compromised by thermal cycling. This paper describes a technology that eliminates these issues by using coplanar copper or other metal pads on a rigid or Flexible PCB to sense the temperature. Multiple pads can be placed on a surface, making it possible to create a thermal profile over the measured in real time.
This paper will describe a technology that eliminates the need for a discrete temperature sensing devices (thermistor, thermocouple, RTD etc) and instead uses one or more copper pads on a rigid or flexible circuit board surface to measure temperature.
This is an in situ, real time thermal measurement. It opens up a lot of possibilities in design of circuits that require precise thermal measurements.
Safety, high reliability and zero profile features can be quite useful in high end applications.