designcon is part of the Informa Markets Division of Informa PLC
This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.
April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Maryna Nesterova (R&D engineer, Aprel Inc)
Stuart Nicol (CEO, Aprel Inc)
Yuliya Nesterova (Master's Student, Carleton Univeristy)
Location: Ballroom D
Date: Thursday, April 7
Time: 9:00 am - 9:45 am
Track: 11. Electromagnetic Compatibility & Interference, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Vault Recording: TBD
Audience Level: All
Any coupling event between different elements within an IC affects its performance. Furthermore, if the IC near field is interfering with components on the Printed Circuit Board (PCB), multiple possible reactive events could generate problems relating to Power Integrity (PI), Signal Integrity (SI) or EMC compliance issues.
Presented experimental data demonstrate how the IC near field interference could be detected through measurement using the H-field vector probe. Higher resolution scans identified the coupled sources' locations along with various coupling configurations. The prime detected source of the IC magnetic field appeared to be an inductor with a horizontally oriented coil loop. The observed distortions of its torus-like vector field imply the presence of interference with other components. H-vector analysis for different probe orientations revealed the types of various coupling and their origins. Different test setup parameters, such as resolution step and probe rotation, provided a trade-off between accuracy and uncertainty of the magnetic field assessment when evaluating of the sources and nature of electromagnetic interference problems. For the analysis conducted, we were able to identify an SI issue which impacted the data rate over the USB C interface, thus impacting optimal performance.
ICs' in-chip coupling events could be detected through measurement of the magnetic field using the H-vector probe rotating 360 degrees.
Anyone with an interest in IC or PCB design would benefit from the presented methodology, which seeks to deliver a precise and comprehensive assessment of sources of cross-talk in complex reactive near-field vector distributions using the 360-degree probe rotation technique.