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DesignCon 2019 Presentation Viewer

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Modeling of Critical Crosstalk Paths for High Sampling Rate RF Direct Data Converters Integrated in a Programmable RF SoC

Brandon Jiao (Staff Transceiver Technical Marketing Engineer, Xilinx)

Romi Mayder (Senior Director of Technical Marketing, Xilinx)

Ntsanderh C Azenui (Senior Application Engineer, Ansys)

Andrew Wang (Application Engineer Manager, Ansys)

Location: Ballroom G

Date: Wednesday, January 30

Time: 2:00pm - 2:40pm

Track: 06. Applying Chip-to-Chip and Advanced PCB Design & Simulation Techniques

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

Traditional crosstalk depression technics such as using stripline, setting routing space between traces and providing vertical return paths for layer transition vias and package/ connector signal pins are well applied in transceiver applications. Though these methods provide enough isolation for 100GE CR4/KR4, they are far away from meeting the isolation requirement in RF applications of -100dB noise floor. This gap must be mitigated when SI engineers design RF direct sampling systems with RFSoC integrated with both transceivers and RF ADC/DACs. This paper introduces the new crosstalk depression methodology and analysis based on 3D fields simulation with ultra-low noise floor.


The vertical return path is critical to minimize the crosstalk received at RF ADC/DAC. Co-optimization including flip chip BGA package, PCB stackup and routing, vias and RF connector pin map is a must to
meet the crosstalk requirement in the cost driven RF applications