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More than Moore from an IC Package Designer’s Viewpoint

John Park (Product Management Group Director, Cadence)

Location: Mission City M1

Date: Thursday, January 30

Time: 8:05am - 8:45am

Track: Sponsored Session

Vault Recording: TBD

Cadence Design Systems

This presentation will outline current semiconductor packaging trends driven by “More than Moore” and how they impact the role of a package substrate designer. It’s clear that More than Moore is driving multi-chip(let)-centric designs, but what else does it mean? What other challenges are on the horizon? Learn how today’s tools and flows are evolving to address the challenges of next-generation of IC package designs.