DesignCon is part of the Informa Markets Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.

Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

More than Moore from an IC Package Designer’s Viewpoint

John Park  (Product Management Group Director, Cadence)

Location: Mission City M1

Date: Thursday, January 30

Time: 8:05am - 8:45am

Track: Sponsored Session

Vault Recording: TBD

Cadence Design Systems

This presentation will outline current semiconductor packaging trends driven by “More than Moore” and how they impact the role of a package substrate designer. It’s clear that More than Moore is driving multi-chip(let)-centric designs, but what else does it mean? What other challenges are on the horizon? Learn how today’s tools and flows are evolving to address the challenges of next-generation of IC package designs.