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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Iliya Zamek (Consultant, ZI_Consulting)
Location: Ballroom G
Date: Thursday, April 7
Time: 9:00 am - 9:45 am
Track: 10. Power Integrity in Power Distribution Networks, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Vault Recording: TBD
Audience Level: All
The new Power Integrity (PI) methodology, we recently introduced, is based on the critical impedance approach. This approach helps to remove resonances and transient oscillations in a PDN, while widely accepted methods often fail to do this. By using this approach the transitions in PDN became smooth and shortest, which is the main thing that designers are trying to achieve. However, even the smooth transitions are not perfect, - the charge from the decoupling capacitances to the die is transferred with some deficiency. So, there is a phenomenon that has not been studied enough in the literature, - a voltage decay in a PDN. In the paper, it is shown that this effect is especially detrimental at high-speed changes of the chip operations when VRM could not react fast enough. It is obtained that this decay depends on decoupling capacitors values and time constants, VRM time constants, and became more severe with a misalignment between these time constants. It is demonstrated that the new PI methodology allows the design of the PDN free from resonances and transient oscillations and also mitigate the voltage decay effect.
Knowledge about the voltage decay effect in a PDN and ways of its mitigation.
Power Integrity, Power delivery network (PDN), decoupling capacitors, printed circuit boards (PCB).