Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.
Location: Ballroom C
Date: Wednesday, January 29
Time: 8:00am - 8:45am
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging, 07. Optimizing High-Speed Serial Design
Format: Technical Session
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: All
Conventional multi-connector cables and adaptors solution for device are too cumbersome to meet multimedia users’ desires for portability and simple setup. A new alternate mode over USB Type-C is proposed which combines high-bandwidth display (DP HBR3) and data (USB3.1 SSP) lanes to a single USB Type-C connector to deliver adequate power and bandwidth for premium entertainment. The multiplexing scheme leads to tremendous amount of signal integrity challenges. In this paper, a comprehensive discussion of the new high-speed link design, from system architecture, link budget, design challenges, optimization, to final implementation is presented.
1. Bandwidth, RL, and Xtalk isolation optimization in USB2/USB3 cross-point switch design
2. USB TypeC mid-plate optimization in USB typeC connector for Xtalk improvement
3. Cable redriver gain, connector pinout arrangement to mitigate round-trip Xtalk amplification
4. in cable wire modeling, we add eccentric parameter to show the P/N mismatch