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DesignCon 2019 Presentation Viewer

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Next Generation Wireline Communication Interfaces

Ravi Shivnaraine (Circuit Design Engineer, IP Cores, Rambus)

Saman Sadr (VP IP Cores Marketing, Rambus)

Location: Great America 3

Date: Wednesday, January 30

Time: 3:45pm - 4:25pm

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD


Electrical, Optical and Signal Integrity challenges of the next generation wireline communication connectivity will be reviewed. Solutions for direct connectivity between Electrical and Optical interfaces will be presented, and 2.5D/3D advanced packaging and fabrication technology requirements will be explored.