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DesignCon 2019 Presentation Viewer

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Next Generation Wireline Communication Interfaces

Ravi Shivnaraine (Circuit Design Engineer, IP Cores, Rambus)

Saman Sadr (VP IP Cores Marketing, Rambus)

Location: Great America 3

Date: Wednesday, January 30

Time: 3:45pm - 4:25pm

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD


Electrical, Optical and Signal Integrity challenges of the next generation wireline communication connectivity will be reviewed. Solutions for direct connectivity between Electrical and Optical interfaces will be presented, and 2.5D/3D advanced packaging and fabrication technology requirements will be explored.