designcon is part of the Informa Markets Division of Informa PLC
This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.
April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Sherry Hess (Product Marketing Group Director, Cadence)
Location: Mission City Ballroom B5
Date: Thursday, April 7
Time: 9:00 am - 9:45 am
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Vault Recording: TBD
Audience Level: All
For many years, tools for IC and PCB design teams came from different software developers, and simulation tools came from third-party electronic design automation (EDA) companies. Each EDA company sold to an engineer that had a specific task and it was up to the systems designer to stitch together working flows. This has resulted in design teams working in silos, creating roadblocks to quickly and efficiently producing finished products that need to work as a single complete solution.
Fortunately, EDA has come a long, long way. Chip, IC package, and PCB design tools, as well as simulation solutions, are now available that can analyze the electrical integrity of the designs for each fabric available from a single EDA vendor. This keynote session will talk about strategies system developers can deploy to avoid a "throw it over the wall" mentality and instead simulate and analyze designs from one or more fabrics, whole, as the design progresses from concept through to sign-off and manufacturing.