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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Kyle Chen (Principal Hardware Engineer, Microsoft)
Suomin Cui (Senior Software Architect , Cadence Design Systems)
Grace Yu (Director of Electrical Engineering, Microsoft)
Jian Lui (Sr. Software Engineering Group Director , Cadence Design System)
Location: Ballroom F
Date: Wednesday, April 6
Time: 9:00 am - 9:45 am
Track: 07. Optimizing High-Speed Link Design, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Vault Recording: TBD
Audience Level: All
The augmented/mixed reality (AR/MR) wearable devices are one of edge applications. The AR/MR Head Mounted Displays (HMDs) need to overcome integrations with many sensors to serve different purposes and capabilities. They also require small and tight physical form to be a comfortable wearable device. Flexible printed circuits (FPCs) provide a practical solution for interconnection between PCB and electronic sensors within a tight form-factor. FPC can achieve a great impedance control like rigid boards or coaxial cables. In this paper, the SI optimization by applying accurate 3D finite element models will be covered. In general, 3D solver is time-consuming even though significant improvements have been made recently. Bayesian optimization is an approach to optimizing objective functions that take a long time (minutes or hours) to evaluate, therefore, it is perfect to integrate Bayesian optimization with 3DEM solver and address the critical SI issues in FPCs. We will highlight new 3D EM technology showing the results of algorithms where Bayesian optimization is utilized. Several SI improvements will be discussed for FPCs, including impedance, common mode conversion, cross-talking FEXT and NEXT, and effectiveness of EMI film. Finally, SI simulation vs measurement correlation results will be presented.
Bayesian optimization is an approach to optimizing objective functions that take a long time (minutes or hours) to evaluate, therefore, it is perfect to integrate Bayesian optimization with 3DEM solver and address the critical SI issues in FPCs.