April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA


Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Overpass – the roadmap to 56G, 112G and 224G IO interconnect solutions

Speaker:

Vishal Chandrasekar  (OverPass® Product Line Manager, Amphenol)

Location: Mission City Ballroom B4

Date: Wednesday, April 6

Time: 1:15 pm - 2:00 pm

Track: Sponsored Session

Format: Sponsored Session

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

This session will introduce HSIO OverPass® technology and solutions – what it is, its advantages, and why it is necessary as systems march towards higher electrical signaling speeds. The discussion will include an introduction to current and future product offerings and deployment scenarios.

Takeaway

- Significant loss budget and system cost advantages associated with OverPass® technology
- Superior SI performance and bandwidth density of near chip interfaces – DensiLink® and MicroLinkOVER™
- Technology that is well suited now and necessary in the future