April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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Overview and Challenges of Running D2D over Interposers


Ken Willis  (Product Engineering Group Director - System-Level Analysis, Cadence)

Location: Mission City Ballroom B5

Date: Thursday, April 7

Time: 11:00 am - 11:45 am

Track: Sponsored Session

Format: Sponsored Session

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

As engineers turn to chiplet-based approaches using interposers to achieve their heterogenous integration goals, D2D interfaces like AIB find increasing relevance. This parallel bus standard has become one of the key enablers for this new wave of designs to efficiently interconnect chiplets. This session will provide an overview of the AIB standard, as well as extraction and simulation methodologies to enable compliance signoff for your AIB interfaces.