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Panel – 112-Gbps Electrical Interfaces: An OIF Update on CEI-112G

Brian Holden (VP of Standards, OIF PLL MA&E Co-Chair, Kandou Bus SA)

Steve Sekel (400G/800G Specialist, OIF PLL Interoperability Chair, Keysight Technologies)

Cathy Liu (R&D Director, OIF Board Member, Broadcom)

Nathan Tracy (Technologist, OIF VP of Marketing, TE Connectivity)

Location: Ballroom G

Date: Thursday, January 31

Time: 3:45pm - 5:00pm

Track: 08. Optimizing High-Speed Serial Design, 10. High-Speed Signal Processing, Equalization & Coding

Session Type: Panel Discussion (Free)

Vault Recording: TBD

Audience Level: All

A panel of OIF contributors will discuss the ongoing, multi-faceted CEI-112G interface effort, the eighth generation of industry enabling electrical interfaces defined by the OIF. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G. Applications of these include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.

Takeaway

The audience should learn what the CEI-112G family of Interoperability Agreements (IAs) are, where they came from, how they are used, and the state of development of these IAs. They should also gain some sense of the intense implementation, use and measurement challenges associated with CEI-112G.

Intended Audience

Some knowledge of high-speed interconnects