DesignCon is part of the Informa Markets Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.

Early Bird Registration Now Open till November 30th. Save Up to $300 Today!

DesignCon 2019 Presentation Viewer

Purchase procecdings

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

If you’d like to do a bulk download of all conference presentations or technical papers at once, please click here for conference presentations or click here for full technical papers. For sessions not included in the main conference, click here for Chiphead Theater presentations or click here for sponsored session presentations.

Panel – 112-Gbps Electrical Interfaces: An OIF Update on CEI-112G

Brian Holden (VP of Standards, OIF PLL MA&E Co-Chair, Kandou Bus SA)

Steve Sekel (400G/800G Specialist, OIF PLL Interoperability Chair, Keysight Technologies)

Cathy Liu (R&D Director, OIF Board Member, Broadcom)

Nathan Tracy (Technologist, OIF VP of Marketing, TE Connectivity)

Location: Ballroom G

Date: Thursday, January 31

Time: 3:45pm - 5:00pm

Track: 08. Optimizing High-Speed Serial Design, 10. High-Speed Signal Processing, Equalization & Coding

Session Type: Panel Discussion (Free)

Vault Recording: TBD

Audience Level: All

A panel of OIF contributors will discuss the ongoing, multi-faceted CEI-112G interface effort, the eighth generation of industry enabling electrical interfaces defined by the OIF. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G. Applications of these include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.


The audience should learn what the CEI-112G family of Interoperability Agreements (IAs) are, where they came from, how they are used, and the state of development of these IAs. They should also gain some sense of the intense implementation, use and measurement challenges associated with CEI-112G.

Intended Audience

Some knowledge of high-speed interconnects