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Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Panel – Next Gen Materials for High-Speed Digital Design

Bill Hargin (Director of Everything, Z-zero)

Don DeGroot (President, CCN Labs)

Allen Horn (Research Fellow, Rogers Corporation)

Location: Ballroom G

Date: Wednesday, January 29

Time: 3:45pm - 5:00pm

Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 07. Optimizing High-Speed Serial Design

Format: Panel Discussion

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass, Boot Camp Pass, Expo Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

The objective of this panel session is to discuss the need for glass-reinforced or PTFE dielectrics that can support the needs of 28, 56, 112, or 128 Gbps, along with developing a system for winnowing the list of laminate possibilities from different laminate vendors—or within the same vendor once you've chosen a laminate.

In this panel session, we'll nail down the answers to this quintessential design concern once and for all – or entertain you while some of the experts slug it out!

Takeaway

Attendees will walk away with an understanding of the latest products on the market for high-speed design and selection mechanisms for winnowing the list.