April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
DesignCon 2022 Schedule Builder
Panel – OIF Electrical I/O Specifications: Progress on CEI 112Gbps & 224Gbps
Moderator:
Nathan Tracy (Technologist, TE Connectivity)
Panelists:
Cathy Liu (Distinguished Engineer, Broadcom Inc.)
John Calvin (Senior Strategic Planner, IP Wireline Solutions, Keysight Technologies)
Mike Li (Fellow, Intel)
Jeffery Maki (Distinguished Engineer II, Juniper Networks)
Location: Ballroom D
Date: Wednesday, April 6
Time: 4:00 pm - 5:15 pm
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Vault Recording: TBD
Audience Level: All
It is well known that OIF has enabled the industry over the past 20+ years by providing interoperable electrical interface specifications known as CEI (common electrical I/O) that have been adopted across many applications to become critical building blocks for a number of industry standards and platforms. Join a panel of industry experts and OIF members to participate in a discussion on the lessons learned on CEI-112 Gbps specifications and the in-progress CEI-224 Gbps specification developing projects. The panel will discuss some of the trade-offs and decisions that had to be addressed in the OIF's seven CEI-112G reach specifications to enable optimization of reach, power, and cost, and then looking forward to 224 Gbps. The panel members will discuss and debate the challenges being addressed to enable 224 Gbps electrical I/O interface solutions where the reach, performance, power, and cost optimizations become even more critical to keep the industry moving forward with a next generation of interoperable electrical I/O interface specifications.
