April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

DesignCon 2022 Schedule Builder


Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.
Sign In Create Account Export | Need Help?
All Sessions Speakers My Schedule

Panel – What is Needed for 224Gbps? System & Chip Vendors Perspective

Moderator:

Cathy Liu  (Distinguished Engineer, Broadcom Inc.)

Panelists:

Srinivas Venkataraman  (Signal Integrity Engineer, Facebook)

Pirooz Tooyserkani  (Principal Engineer, Cisco Systems, Inc.)

Pervez Aziz  (Senior Principal Engineer, Nvidia)

Richard Ward  (VP & GM of the Data Connectivity Group, Astera Labs Inc)

Location: Ballroom H

Date: Thursday, April 7

Time: 4:00 pm - 5:15 pm

Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design

Format: Panel Discussion

Theme : High-speed Communications

Education Level: All

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Vault Recording: TBD

Audience Level: All

To meet the next-generation system bandwidth requirement, recently industry and standard bodies are aiming at 800GE and 1.6TE. The next generation switch is targeting 100T capacity as well. The next speed node of 200+ Gbps per lane becomes critical to scale the switch capacity and efficiency of networking bandwidth. Join this panel of experts for a lively panel discussion on what is needed for the next speed note 224 Gbps. In this panel end users, system vendors and chip developers will discuss and share the insights on their system needs and gaps, design challenges and solutions for next generation high-speed networking technologies. It will provide the audience an opportunity to hear and discuss new technologies such as optical/electrical interconnect in data centers, co-packaging optics (CPO), advanced modulation, signal processing, and coding.

Takeaway

Lively discussion on what is needed for the next generation networking system with 224 Gbps interface. Great educational and inspired value to all participants.