DesignCon 2022 Schedule Builder

Properties of conductors and dielectric materials primarily determine the performance of high-speed circuitry fabricated on printed circuit board (PCB) technology. Particularly, understanding and accurately characterizing the frequency-dependent properties of inhomogeneous materials is key to the optimal design of high performance but cost-effective PCB antennas required to enable the plethora of devices forecasted for 5G/6G communication. In this regard, it is known that standard resin-systems reinforced with glass fabrics can introduce substantial variations in Dk and Df depending on the position and routing of the conductor traces guiding the high-frequency signals. Therefore, advanced materials with tightly spaced glass fibers and improved resin formulations have been developed to improve the Q-factor of interconnects and passive components fabricated on PCBs. In order to assess the performance of two advanced laminate materials, several microstrip lines and patch antennas were fabricated on two PCB prototypes implemented with low profile copper intended for high-frequency applications. Within each prototype, the lines and antennas are routed at different angles with respect to the fiber weaves to inspect Dk, Df, and impedance variations, as well as variations in occurrence and magnitude of the antenna resonances. Measurements up to 100 GHz were performed, processed and analyzed to achieve this robust characterization.

Takeaway

Modeling & Simulation techniques.
Dielectric material characterization methods.
Inhomogeneous dielectric material designed Patch Antenna attributes.
Performance metrics exhibiting consistent antenna resonance frequency & optimal amplitude.

Intended Audience

Dielectric material characterization (high frequency dependent Dk & Df properties)
Conductor roughness characterization (Rz, RMS, Copper surface roughness models)
Patch Antenna performance (gain, bandwidth etc)