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Sherman S. Chen (Principle SI/PI engineer, Kandou Bus)
John Phillips (Principal Application Engineer, Cadence Design Systems)
Location: Ballroom C
Date: Thursday, January 30
Time: 9:00 am - 9:45 am
Track: 02. Chip I/O & Power Modeling & Validation Solutions, 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: All
Lightning Talks are technical papers that were accepted as part of the DesignCon conference, but are being made available to all attendees as short sessions in the Chiphead Theater.
In this paper, we compared the PDN models obtained with 2.5D extractor and 3D full wave solver. The resulted deviations on both frequency domain impedance curves and time domain power noise brought by these two kinds of models were analyzed. The influences of different 2.5D extractor setting including pin based vs net based, selections of reference nodes, s-parameter vs spice model, are investigated. Similarly, the influences of key 3D solver setup options were also studied and the corresponding effects were summarized. In the end, a set of design guideline on selecting the best approach for different design scenarios are presented.
1. The differences of impedance curve and time domain noise resulted from 2.5D and 3D modelers.
2. The BKM for setting up 2.5D and 3D solver tools.
3. How to select solvers for different design scenarios.
Slides_08_PowerCouplingExtractionMethodComparison_Chen1578954167951.pdf
PAPER_Track02_PowerCouplingExtractionMethodComparison_Chen.pdf