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Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Power Delivery Improvement & Noise Reduction Using Ultra-Thin (8um) PCB Layers: Simulation, Board Measurements & Practice

Igal Fridman  (Hardware Engineer, Major Technology Company)

Alex Manukovsky  (Technical Lead, SI/PI Team, Intel)

Shimon Mordooch  (R&D Project Manager, Harmonic Video Networks)

Robert Carter  (Vice President of Technology and Business Development, Oak-Mitsui Technologies)

Amiram Jibly  (High Speed System Design, Intel)

Location: Ballroom G

Date: Thursday, January 30

Time: 2:00pm - 2:40pm

Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 10. Power Integrity in Power Distribution Networks

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: Intermediate

This paper examines the use of distributed capacitors based on ultra-thin film PCB laminates (below 0.4 mil) for controlling PDN impedance at the MHz to GHz frequency band of fine pitch BGA design. Ultra-thin PCB material has inherent capacitance properties, presenting an elegant wide band decoupling solution for PDN, the benefits of which were proven by simulation in previous work. This work demonstrates a practical implementation of this concept. Various alternative ultra thin laminates are examined, while providing a power integrity simulation and corresponding lab measurements and post manufacturing analysis for the leading ones. Additional practical aspects, such as the less explored manufacturability and reliability considerations, required for successful implementation, are discussed.


Existing PCB designs can be significantly improved just by adopting ultra-thin laminates in stack-up for PDN, eliminating the need for additional expensive design changes. This study will show the ultra-thin manufacturing techniques/ know-how.

Intended Audience

Basic concepts in power integrity
Basic concepts in PDN design

Presentation Files