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Location: Ballroom G
Date: Thursday, January 30
Time: 2:00pm - 2:45pm
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: Intermediate
This paper examines the use of distributed capacitors based on ultra-thin film PCB laminates (below 0.4 mil) for controlling PDN impedance at the MHz to GHz frequency band of fine pitch BGA design. Ultra-thin PCB material has inherent capacitance properties, presenting an elegant wide band decoupling solution for PDN, the benefits of which were proven by simulation in previous work. This work demonstrates a practical implementation of this concept. Various alternative ultra thin laminates are examined, while providing a power integrity simulation and corresponding lab measurements and post manufacturing analysis for the leading ones. Additional practical aspects, such as the less explored manufacturability and reliability considerations, required for successful implementation, are discussed.
Existing PCB designs can be significantly improved just by adopting ultra-thin laminates in stack-up for PDN, eliminating the need for additional expensive design changes. This study will show the ultra-thin manufacturing techniques/ know-how.
Basic concepts in power integrity
Basic concepts in PDN design