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Predicting Field Failure From Small Environmental Stresses

Douglas C and Deborah Smith (Engineering Consultant, D. C. Smith Consultants)

Location: Ballroom D

Date: Thursday, January 31

Time: 2:00pm - 2:40pm

Track: 12. Electromagnetic Compatibility/Mitigating Interference, 13. Applying Test & Measurement Methodology

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

Applying small stresses to circuits can help predict circuit failure in the field at both the IC and PCB level. Accumulating damage has been demonstrated from thousands of very small ESD events resulting in field failure. In addition, application of small electrical stresses can also find weak spots in a design that can lead to soft errors. These topics and related issues will be discussed with examples and stories from the field to give context to the principles covered.

Takeaway

1. New, simple lab tests to identify and reduce potential field failures.
2. Details on current waveforms used for these tests
3. Extended usefulness of current standards

Presentation Files

PAPER_12_PredictingFieldFailureFromSmall_Smith.pdf
SLIDES_12_PredictingFieldFailureFromSmall_Smith.pdf